EIC-QCS8250-210 Development Kit is based on high performance Qualcomm® QCS8250. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm Kryo 585 application processors, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm® Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 kit comprises of Qualcomm® QCS8250-based SoM and a carrier board. It supports long range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. Moreover, it provides a variety of standard interfaces such as GPIO, I2C, UART, SPI, USB3.1, PCIE Gen 3.0, and I2S.
QCS8250 kit comes with Android 10 support which further helps in early prototyping and parallel software development. The QCS8250 development kit is suitable for applications that need high resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics. The kit is ideal to kick-start development of intelligent devices like Collaboration Devices, Smart Robots, AR/VR Devices, Home/Industrial Automation and Intelligent Cameras.
ExploreEIC-QCS8250-200 System-on-Module (SoM) is a high performance module based on Qualcomm® QCS8250. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm Kryo 585 application processors, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm® Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 SoM supports long range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. Moreover, it provides a variety of standard interfaces such as GPIO, I2C, UART, SPI, USB3.1, PCIE Gen 3.0, and I2S.
QCS8250 SoM is suitable for applications that need high resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics. The module is ideal to kick-start development of intelligent devices like Collaboration Devices, Smart Robots, AR/VR Devices, Home/Industrial Automation and Intelligent Cameras.
ExploreeInfochips EIC-LCD-1080P, is a 5.5” touch screen LCD display that can be used with both Eragon 410 and Eragon 820 development kits. This LCD supports 1080 x1920 (FHD) resolution, and operates at 5V voltage supply. It integrates with Eragon 410/Eragon 820 over MIPI DSI interface (4 lane) and uses I2C for touch interface configuration.
eInfochips offers a complete camera system consisting of an interface board with camera module. This system can be connected to an existing Eragon 410 development kit for quick prototyping. The system consists of a camera module solution based on SONY IMX135 Image Sensor Chip. It is a highly integrated 13MP camera chip that includes a CMOS image sensor, image correction functionality and serial transmission using 4-lane/2-lane MIPI.
ExploreeInfochips offers a complete camera system consisting of an interface board with camera module. This system can be connected to the existing Eragon 820 development kit for quick prototyping of multimedia solutions. The system consists of a camera module solution on a single chip (OV5640), with autofocus (AF) solution. It supports 5 MP still image capture along with 720p@60 FPS and 1080p@30 FPS video streaming capability. It interfaces with the board over the MIPI Interface.
ExploreeInfochips also offers a camera module that is compatible with the Eragon 845 hardware development kit. There are three camera sensors mounted on EIC_Q845_CAM with flash LEDs including IMX318 (22.5 Mega-Pixel) and IMX258 (13 Mega-Pixel) sensor.
ExploreeInfochips offers a complete camera system consisting of an interface board with camera module. This system can be connected to the existing Eragon 410 development kit for quick prototyping of multimedia solutions.The system consists of a 5-megapixel camera module solution on a single chip (OV5640), with autofocus (AF) solution. It interfaces with the board over MIPI Interface.
EIC-QCS410-200 System-on-Module is based on powerful Qualcomm® QCS410 Quad-core SoC, comprising 64-bit ARM® Cortex™ CPU, Qualcomm® Hexagon™ DSP and an integrated Qualcomm® Adreno™ 608 GPU. Multi-core processing and advanced video codec offers high-resolution video capture at low power. The module offers tight system integration and optimization for superior performance and power efficiency. It also offers multiple connectivity solutions with integrated Qualcomm® Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0. The design is also pin compatible and software compatible with Qualcomm® QCS610 making it an ideal choice for Industrial IoT, Smart AI Home Security, Home IP Cameras, Enterprise Security Cameras, Dash Cam and Body Cam, Smart Display, Videoconferencing applications.
In addition to SoM, eInfochips also offers a development kit as part of the Eragon QCS410 product line for benchmarking and PoC development.
EIC-Q610-200 System-on-Module is based on Qualcomm® QCS610 comprising 64-bit Octa-Core ARM® Cortex™ CPU, Qualcomm® Hexagon™ DSP and an integrated Qualcomm® Adreno™ 608 GPU. Multi-core processing and advanced video codec offers high-resolution video capture at low power. The module offers tight system integration and optimization for superior performance and power efficiency. It also offers multiple connectivity solutions with integrated Qualcomm® Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0. The design is also pin compatible and software compatible with Qualcomm® QCS410 making it an ideal choice to kick-start development of IoT, camera and wearable devices.
In addition to SoM, eInfochips also offers a development kit as part of the Eragon 610 product line for benchmarking and PoC development.
eInfochips’ Eragon 410 SoM is a high performance System-on-Module based on Snapdragon 410, that consists of 64 bit quad-core ARM® Cortex® A53 to offer advanced processing capabilities at low power. Eragon 410 SoM is a cost effective, ultra-small form factor (35mm x 26mm) module low power consumption, connectivity, multimedia functionality, along with solid processing power. The SoM offers on-chip eMCP memory (1GB LPDDR3 + 8GB eMMC) . Eragon 410 product line provides benefit of Price, Performance, Package and Power making it an ideal solutions for robotics, infotainment, automation and control - and Internet of things (IoT) devices, including wearable technology.
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