EIC-QCS8250-210 Development Kit is based on high performance Qualcomm® QCS8250. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm Kryo 585 application processors, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm® Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 kit comprises of Qualcomm® QCS8250-based SoM and a carrier board. It supports long range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. Moreover, it provides a variety of standard interfaces such as GPIO, I2C, UART, SPI, USB3.1, PCIE Gen 3.0, and I2S.
QCS8250 kit comes with Android 10 support which further helps in early prototyping and parallel software development. The QCS8250 development kit is suitable for applications that need high resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics. The kit is ideal to kick-start development of intelligent devices like Collaboration Devices, Smart Robots, AR/VR Devices, Home/Industrial Automation and Intelligent Cameras.
* This is preliminary information and subject to change without notice.