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Eragon™ 855: EIC-Q855-210

The Eragon 855 hardware development kit (HDK) is based on Qualcomm® Snapdragon™ 855 processor that offers next generation on-device AI capabilities to make voice, camera, gaming and power management smarter, faster and more intuitive. This HDK is an ideal platform to kick-start development of embedded devices for AR/VR, infotainment, 4K cameras as well as automation solutions. The main purpose of Snapdragon 855 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market.  

Note:

  • Due to high demand, please expect 9 - 10 weeks of lead time once the order has been placed.
$1,149.00
Quantity -
CPU
CPU Name Qualcomm® Snapdragon™ 8150
CPU Type Qualcomm® Kryo™ 485
CPU Cores 8
CPU Clock (Max) 2.7 GHz
MEMORY
LPDDR4 6GB LPDDR4X PoP memory
UFS 128GB UFS 2.1
MULTIMEDIA
2D/3D Graphics Acceleration Adreno™ 640 GPU
Video Encode Video encode up to 4K60
Concurrent 4K60 decode and 4K30 encode for wireless display
Video Decode Video decode up to 4K120 or 8K30
Camera Interfaces 4x 4-Lane MIPI CSI DPHY or 4x 3-Trio MIPI CSI CPHY via 160-pin Camera Connector
DISPLAY
DSI

2x 4-Lane MIPI DSI DPHY or 2x 3-Trio MIPI DSI CPHY via 60-pin High Speed Display Connector

HDMI 1.4 via MIPI DSI -> HDMI bridge, up to 4K30

DisplayPort over USB3.1 Type-C
NETWORKING
Wi-Fi 802.11a/b/g/n/ac 2.4/5GHz
Bluetooth Bluetooth 5.0 + HS (backward compatible)
AUDIO
Audio

Qualcomm® WCD9341 audio codec on-board

1x 40-pin B2B connector

1x Headset headphone output

2x loud-speaker output

1x Earpiece output

4x Analog MIC input

4x Digital MIC input
CONNECTIVITY
SD 1x microSD card
USB 2x USB 3.0 Type A Host, 1x Type-C USB3.1
UART USB Micro B connector (for Serial Debug)
PCI-E 1x mini PCIe interface
Sensors

Support via Sensor Card

  • Accelerometer / Gyrometer
  • Magneto
  • Ambient Light Sensor/Proximity
  • Pressure
  • Hall
JTAG

1x JTAG

GPS Integrated Qualcomm GNSS (GPS/GLONASS/COMPASS/GALILEI)
GPIO Via 1x 60-pin B2B High Speed Expansion connector
OS SUPPORT
Android 9.0
MECHANICAL SPECIFICATIONS

Dimensions (W x L)

100 mm x 85 mm
ELECTRICAL SPECIFICATIONS
Supply voltage

12V/5A DC Main Supply

 (*Power supply not part of Kit content)
Digital I/O voltage

1.8 V

ENVIRONMENTAL SPECIFICATIONS
Ambient Temperature Range -30°C to +85°C (Ambient)

Note :

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