eInfochips QCS8250: EIC-QCS8250-200 Qualcomm® QCS8250 based System on Module

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eInfochips QCS8250: EIC-QCS8250-200

EIC-QCS8250-200 System-on-Module (SoM) is a high performance module based on Qualcomm® QCS8250. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm Kryo 585 application processors, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm® Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 SoM supports long range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. Moreover, it provides a variety of standard interfaces such as GPIO, I2C, UART, SPI, USB3.1, PCIE Gen 3.0, and I2S.

QCS8250 SoM is suitable for applications that need high resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics. The module is ideal to kick-start development of intelligent devices like Collaboration Devices, Smart Robots, AR/VR Devices, Home/Industrial Automation and Intelligent Cameras.

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Specification
Resources

CPU Name

Qualcomm® QCS8250

CPU Type

Qualcomm® Kyro™ 585, 64-bit applications processor with a 4MB L3 cache

CPU Cores

Octa-core

Quad high-performance Kryo Gold cores
Quad low-power Kryo Silver cores

MEMORY
LPDDR5	8GB LPDDR5 (PoP)
Flash	64GB UFS 3.1/2.1

MULTIMEDIA
Graphic Controller	Adreno 650
Video Encode	4K120/8K30 encode for H.265 Main 10, H.265 Main, H.264 High, and VP8 codecs
Video Decode	4K240/8K60 decode for H.265 Main 10, H.265 Main, H.264 High, VP9 profile 2, VP8, and MPEG-2 codecs
Camera Interfaces	Qualcomm Spectra 480 Camera ISP 6 x 4-lane CSIs (4-Lane each) D-PHY & C-PHY (supported by design)

DISPLAY
DSI	2 x 4-lane MIPI-DSI, DisplayPort 1.4 data concurrency over USB 3.1 Type-C

DISPLAY

DSI

2 x 4-lane MIPI-DSI,

DisplayPort 1.4 data concurrency over USB 3.1 Type-C

NETWORKING
Wi-Fi	2.4G/5G, support 802.11 a/b/g/n/ac/ax, 2 x 2 MIMO (QCA6391)
Bluetooth	Support Bluetooth 5.1 + HS (QCA6391)

AUDIO
Audio	SoundWire interface for codec and smart speaker amplifier 3 x PDM DMICs 2 x MI2S

AUDIO

Audio

SoundWire interface for codec and smart speaker amplifier

3 x PDM DMICs

2 x MI2S

CONNECTIVITY
USB	1 x USB 3.0 1 x USB 3.1 Type-C port with DisplayPort support
PCIe	2 x 2-lane PCIe Gen3.0
GPIO	Available on low speed expansion connector
Other Interfaces	1 x UART 1 x SDC for SD card 3 x DMICs High-speed and Low-speed expansion headers

OS SUPPORT
OS	Android 10

MECHANICAL SPECIFICATIONS
Dimensions (W x L)	59.7mm x 32.2mm

ELECTRICAL SPECIFICATIONS
Supply voltage	12V/5A DC Main Supply (supplied using carrier board)
Digital I/O voltage	1.8 V

Documentation

- eInfochips QCS8250 SoM Technical Datasheet Download

Note :

* This is preliminary information and subject to change without notice