EIC-QCS8250-200 System-on-Module (SoM) is a high performance module based on Qualcomm® QCS8250. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm Kryo 585 application processors, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm® Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 SoM supports long range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. Moreover, it provides a variety of standard interfaces such as GPIO, I2C, UART, SPI, USB3.1, PCIE Gen 3.0, and I2S.
QCS8250 SoM is suitable for applications that need high resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics. The module is ideal to kick-start development of intelligent devices like Collaboration Devices, Smart Robots, AR/VR Devices, Home/Industrial Automation and Intelligent Cameras.
CPU Name |
Qualcomm® QCS8250 |
CPU Type |
Qualcomm® Kyro™ 585, 64-bit applications processor with a 4MB L3 cache |
CPU Cores |
Octa-core
|
MEMORY |
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LPDDR5 |
8GB LPDDR5 (PoP) |
Flash |
64GB UFS 3.1/2.1 |
MULTIMEDIA |
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Graphic Controller |
Adreno 650 |
Video Encode |
4K120/8K30 encode for H.265 Main 10, H.265 Main, H.264 High, and VP8 codecs |
Video Decode |
4K240/8K60 decode for H.265 Main 10, H.265 Main, H.264 High, VP9 profile 2, VP8, and MPEG-2 codecs |
Camera Interfaces |
Qualcomm Spectra 480 Camera ISP 6 x 4-lane CSIs (4-Lane each) D-PHY & C-PHY (supported by design) |
DISPLAY |
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DSI |
2 x 4-lane MIPI-DSI, DisplayPort 1.4 data concurrency over USB 3.1 Type-C |
NETWORKING |
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Wi-Fi |
2.4G/5G, support 802.11 a/b/g/n/ac/ax, 2 x 2 MIMO (QCA6391) |
Bluetooth |
Support Bluetooth 5.1 + HS (QCA6391) |
AUDIO |
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Audio |
SoundWire interface for codec and smart speaker amplifier 3 x PDM DMICs 2 x MI2S |
CONNECTIVITY |
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USB |
1 x USB 3.0 1 x USB 3.1 Type-C port with DisplayPort support |
PCIe |
2 x 2-lane PCIe Gen3.0 |
GPIO |
Available on low speed expansion connector |
Other Interfaces |
1 x UART 1 x SDC for SD card 3 x DMICs High-speed and Low-speed expansion headers |
OS SUPPORT |
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OS |
Android 10 |
MECHANICAL SPECIFICATIONS |
|
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Dimensions (W x L) |
59.7mm x 32.2mm |
ELECTRICAL SPECIFICATIONS |
|
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Supply voltage |
12V/5A DC Main Supply (supplied using carrier board) |
Digital I/O voltage |
1.8 V |
- eInfochips QCS8250 SoM Technical Datasheet Download
Note :
* This is preliminary information and subject to change without notice